Testing Services

Our Test Engineers and Test Technicians provide:

Burn-in test:
Allows the lifetime of a new component to be accelerated by applying electrical stimulation at a high temperature, and immediately identifies any units that would otherwise have failed early in their lifetime. This allows flawed components to be rejected before distribution.

In-circuit test:
Verifies the correct assembly and operation of each board component, while the component is within the assembled circuit board. A bed-of-nails fixture with supporting test-programming code is used to access all electrical nets on the assembly. The test isolates faults to the component pin, identifies shorts on unconnected output pins, verifies the correct value of analog components and the correct placement and soldering of digital components including ASICs.

Flying probe test:
Utilizes four completely independent test probes that simultaneously apply the stimuli and perform the measurements needed to fully test a printed circuit board. Active and passive analog tests, signature analysis on each test point, boundary scan, and component presence and orientation inspection are performed. This test, similar to in-circuit without the use of a fixture, is ideal for first-piece and prototyping to prove out a design. It saves our customers time and money by improving throughput for new product introductions and eliminating the need for costly replacement fixtures when assemblies are redesigned.

Functional test:
Functionality of the final product can be tested to our customer's specifications utilizing customer furnished test equipment or special test equipment and specifications developed by the Nu Visions team. Technicians test for any anomalies and abnormalities in the assembly, through all stages of development, to verify the assembly will function as intended and to increase the confidence level in the product.

X-Ray Imaging:
Quickly and automatically scans a printed circuit board assembly, analyzes the cross-sectional X-ray images, and identifies the exact location and characteristics of defective solder joints with typical coverage of up to 99%. NuVisions Manufacturing utilizes Nicolet X-Ray Machines and ErsaScopes to verify solder joints of BGA components, ensuring the quality of BGA placements and reducing costly and time consuming component removal and replacement.

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Environmental stress screening (ESS):
Performed on assemblies requiring high-reliability performance. This test precipitates and makes visible any existing latent flaws using thermal cycling as well as thermal shock to exercise the assemblies and expose faults. ESS cycles assemblies through both hot and cold temperatures for a specified duration to weed out infancy failures and assure that assemblies are functioning and reliable, improving customer's satisfaction and confidence of product in the field

Test development services:
Provides test station design to support manufacturing processes with in-circuit test and functional testing, as well as, Functional Test Specification development and In-circuit Test Programming.

Design for Testability (DFT) Analysis:
Increased PCB assembly complexity requires that testability be a major part of the design process. Designing a PCB assembly with test in mind will provide a better solution to rework and repair and allow lower production costs and higher yields with fast turn times.
Our Testing Department utilizes LabVIEW, a networked measurement and automation software application, for program development of Functional Test, Environmental Stress Screening, Burn-In Test and Process Controls. Graphical programming is used to develop a complete test solution that includes designing user interfaces, acquiring, analyzing, and storing data, as well as communicating with drivers and devices. In addition to measurements, LabVIEW integrates networking and Internet technologies into the application.
Imperial Electronic Assembly, Inc. 1000 Federal Road • Brookfield, CT 06804 • 203-740-8425 Fax 203-740-8450 * ISO 9002